EIA/JESDAB. Page 1. TEST METHOD AB. POWER AND TEMPERATURE CYCLING. (From Council Ballot JCB, formulated under the. Find the most up-to-date version of JESDAA at Engineering 4. Power Temp. Cycling. (PTC) JESDA /+°C, If = 20mA on/off = 5min. hrs. 5. Steady state life test. (SSLT) JESDA
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Direct heat conduction to sample s shall be minimized. The power should then be applied and suitable checks made to assure that all devices are properly biased. Precautions should be taken to avoid electrical damage and thermal runaway.
O ther su gges tio ns for d ocu men t impro vemen t: Re qu ire men t, c la use n umber T es t me thod nu mber C laus e number F a x: Power supplies and biasing networks shall be capable a1055 maintaining the specified operating conditions throughout the testing period despite normal variations in line voltages or ambient temperatures. When testing these devices it is important to avoid transient thermal gradients in the samples on test.
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During the test, the power applied to the devices shall be alternately cycled 5 minutes jesf22 5 minutes off unless otherwise specified in the applicable specification. If the test is interrupted as a result of power or equipment failure, the test may restart from the point of stoppage. Ramp rate can be load dependent and should be verified for the load being tested. The test circuitry should also be designed so that existence of abnormal or failed devices does not alter the specified conditions for other units on test.
The electrical measurements shall consist of parametric and functional tests specified in the applicable specification.
JESDAB – Test Method AB, Power and Temperature Cycling
The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. Cycle ramp rate and soak time are more significant for solder interconnections. Samples with large thermal mass and low heat a150 efficiency require ramp rates slow enough to compensate for the thermal mass.
JEDEC standards and publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. These include flip chip, ball grid array and stacked packages with solder jrsd22. The power and temperature cycling test is performed to determine the ability of a device to withstand alternate exposures at high and low temperature extremes with operating biases periodically applied and removed.
Care should be taken to avoid possible damage from transient voltage spikes or other conditions that might result in electrical, thermal, or mechanical overstress.
The temperature of the sample should be within a few degrees of the ambient temperature during the temperature ramps. Jsed22 of YMnO3 on the Rec ommend a tions fo r cor rec tion: No claims to be in conformance with this standard may be made unless all requirements stated in the standard are met.
a05 Mechanical damage shall not include damage induced by fixturing or handling or the damage is not critical to the package performance in the specific application. The devices shall concurrently be cycled between temperature extremes for the specified number of cycles.
The low temperature to high temperature transition or reverse sequence is acceptable. A combined power cycle I rec ommen d cha nges to the fo llow in g: Deviations must be corrected prior to further cycling to assure the validity of the qualification data. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally.
The time at the high and low temperature extremes shall be sufficient to allow the total mass of each device under test to reach the specified temperature extremes with no power applied. By downloading this file the individual agrees not to charge for or resell the resulting material.
JESDAC-Power and Temperature Cycling_百度文库
IGBT Power cycling and It is intended to simulate worst case conditions encountered in typical applications. The power and temperature cycling test is considered destructive. A combined power and e The test setup should be monitored initially and at the conclusion of a test interval to establish that all devices are being stressed to the specified requirements.
jezd22 If liquid nitrogen LN2 is used, care must be taken to avoid direct exposure of the parts and boards to the LN2. NOTE Power duty cycle is usually expressed as a percentage.